IEI | Large Magnetron Etch System for 300mm Substrates








MRIE system have been built in a range of sizes and configurations that include both development-scale types for small samples to auto loading systems for 300mm substrates. All the MRIE systems use an external magnetic field to partially confine plasma electrons. This produces high plasma density and large ion current and also reduces the plasma sheath voltage for low ion energy and efficient ion activation of the etch chemistry. The addition of an inductive remote source allows independent control of the ion current and energy.

Magnetron Etch System with Inductive Remote Source

Polymer Etching with Remote Source Magnetron


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